Custom PCB Packaging Solutions: Protecting Performance, Built for Scale

Overview

At RDM Innovation, we go beyond circuit design to deliver custom PCB packaging solutions that protect and enhance your technology. Based in the USA, we partner with engineering organizations to create enclosures and mechanical systems that ensure durability, thermal efficiency, and seamless integration with embedded designs. Whether it’s a rugged IoT sensor or a compact automotive module, our packaging solutions are tailored to your specs, environment, and production goals.

Core Services

Custom Enclosure Design
Precision-engineered enclosures for PCBs using Nordic, ESP, and TI platforms, balancing size, weight, and protection for applications like BLE-enabled devices or power-optimized systems.
Thermal Management Solutions
Packaging with integrated heat sinks, vents, and conductive materials to manage dissipation—critical for high-performance embedded systems and extended device reliability.
Environmental Protection
Ruggedized designs with IP-rated sealing (e.g., IP65, IP68) and shock resistance, perfect for industrial, automotive, or outdoor IoT deployments.
Compact & Lightweight Packaging
Miniaturized enclosures for wearables, medical devices, and consumer electronics, optimized for space without compromising PCB functionality or power efficiency.
Production-Ready Integration
From prototype housings to mass-production molds, we deliver packaging with DFM (Design for Manufacturability) in mind—streamlining assembly and scaling.

Our Approach

We design PCB packaging as an extension of your embedded system, not an afterthought. Starting with your PCB layout and environmental needs, we use CAD tools like SolidWorks and Fusion 360 to craft enclosures that fit like a glove. Our USA-based team collaborates closely, testing prototypes for thermal performance, ingress protection, and mechanical stress—often alongside Nordic DevKits or TI LaunchPads. We deliver detailed 3D models, assembly instructions, and manufacturing files, ensuring a smooth handoff to your production line.

Packaging Strengths

Integrated Design Expertise: We align packaging with your PCB and firmware—like BLE antenna placement or power module access—maximizing system performance.
Environmental Mastery: Years of designing for harsh conditions—dust, moisture, vibration—means your PCBs thrive where others fail.
Rapid Prototyping: 3D-printed or CNC-machined prototypes in days, letting you test packaging with your Nordic, ESP, or TI boards early and often.
Scalable Solutions: From one-off housings to injection-molded production runs, we optimize for cost, yield, and repeatability—key for engineering scale-up.
USA-Based Craftsmanship: Local design and testing ensure fast iterations, compliance with American standards, and IP security—no overseas bottlenecks.

Industries Served

IoT & Smart Devices: Weatherproof packaging for BLE sensors and ESP gateways.
Automotive: Rugged enclosures for TI-based ECUs and control units.
Aerospace & Defense: Lightweight, MIL-spec packaging for embedded systems.
Consumer Electronics: Sleek, compact designs for wearables and smart home tech.
Industrial Systems: Durable housings for automation and monitoring equipment.

Why Partner with RDM Innovation

System-Wide Thinking: Packaging that complements your PCB and embedded design—unified from the ground up.
Engineering Focus: We prioritize protection, usability, and manufacturability—details that matter to your team.
Proven Resilience: Track record of packaging PCBs for extreme environments, trusted by USA-based innovators.
Flexible Support: Whether it’s a quick prototype or full production run, we adapt to your timeline and process.
Production Seamless: Designs ready for assembly lines, with tolerances and materials spec’d for scale.

Call to Action

Ready to protect your next PCB with packaging that performs? Contact Us to start designing or check our Case Studies for real-world solutions.